Company introduction

Verticle has established in Dublin, CA in 2004, and
currently located at 2480 Mission Street # 222, San Francisco, CA 94110, USA.
Verticle specializes in LED and display technology.
Verticle’s strength is unique LED chip design and fabrication technology.
Verticle owns key LED & display related patents and
has more than 20years of experience in LED chip R&D and production.

Greeting

Mike (M.C.) Yoo, CEO

Enhancing efficiency of AlGaInP native red micro-LED by defect-free wet chemical etching :

- Defect-free and undercut-free wet etching,

- Substantially lower cost and high throughput than dry etching,
Innovative “Chemical Dicing :

- 8X more die per wafer by shrinking die size and street width

- Higher dicing throughput (500X) than laser dicing by multi wafer batch process

- 13X lower CAPEX than laser dicing
Hexagonal Die (HoneycombTM) :

20% more die per wafer than square or rectangular die

Better current spreading; higher light extraction and light output
High current drive and better thermal property :

High current drive capability using low thermal conductivity substrate

Low thermal resistance (Rth); 3X lower than flip chip due to better heat dissipation

what we do

VERTICLE

According to Yole*, die shrink is a major contributor to cost down.
However, it is very hard to resolve these issues with existing chip technology.
Verticle’s Chemical Dicing** can resolve both cost and process issues:

- Dramatic cost down by shrinking die & street width; 8X up die per wafer

- Multi-wafer, batch type dicing; 500X higher throughput than laser dicing

- Exceptionally low CAPEX and process cost compare to laser dicing
Verticle’s LED die have high current drive capability and superior heat dissipation
Yole Développement; https://www.i-micronews.com/apple-jumpstarts-miniled-backlights
** https://www.displaydaily.com/article/display-daily/dicing-with-minileds

Verticle

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